1. INTRODUCTION

The RIFLE-SE system is connected to the DUT by means of a Device Interface Board (DIB). The DIB can contact packaged devices or wafer dies through coaxial cables. The RIFLE-SE system provides an IEEE488 connection and a complete software support to work with any kind of prober.
DIB can be a simple passive board or an advanced active board which can extend the system capabilities through the 1.2Gbps serial expansion bus.
Some examples of active DIB applications are:

• Dedicated switch matrix with high channel-to-channel insulation for single cell analysis;

• Leakage current measurements;

• Multi-channel fast current measurements for transient analysis.

Active Technologies develops the test head following the customer specifications and provides customized solutions to optimize the interconnection between RIFLE-SE and the D.U.T. For this reason, Active Technologies provides two kind of test heads:
- Passive test head
- Active Test Head

2. PASSIVE TEST HEAD
The passive test head is a board with a socket and/or some connectors. The board is developed by using the signal integrity and high speed digital design criteria to achieve the best connection between the RIFLE-SE system and the D.U.T. Multilayer printed circuit boards, ground planes and matched wires are usually used in the test head development.

3. ACTIVE TEST HEAD
If the D.U.T. requires additional digital and/or analog resources, Active Technologies can provide to the customer dedicated solutions. A list of some Active Test Heads is available for a “ready to go” solution.